EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
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EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING